Universal Sensor Interface for Machinery Monitoring System

ABSTRACT

A universal sensor interface for a machine data acquisition system includes a sensor power control circuit that: (1) provides a fast and accurate limiting response to a short-circuit fault, (2) survives and automatically recovers from multiple concurrent continuous short-circuit faults with no interruption to the electrical and thermal integrity of the acquisition system, (3) reduces power consumption/dissipation when in a faulted condition, (4) isolates adverse effects of a faulted channel from uninvolved channels, (5) isolates adverse effects of loose wiring termination “chatter” from uninvolved channels, (6) protects against adverse effects resulting from “hot wiring” of sensors, (7) protects the acquisition system against reasonably anticipated installation wiring errors, and (8) minimizes the availability of spark-inducing energy to the data acquisition system.

RELATED APPLICATIONS

This application claims priority as a continuation-in-part of co-pendingnonprovisional patent application serial numbers:

-   -   Ser. No. 14/808,418, filed Jul. 24, 2015, titled “Processing        Machinery Protection and Fault Prediction Data Natively in a        Distributed Control System,”    -   Ser. No. 14/807,202, filed Jul. 23, 2015, titled “Parallel        Digital Signal Processing of Machine Vibration Data,” and    -   Ser. No. 14/807,008, filed Jul. 23, 2015, titled “Intelligent        Configuration of a User Interface of a Machinery Health        Monitoring System,”        and to provisional patent application Ser. No. 62/240,250, filed        Oct. 12, 2015, titled “Universal Sensor Interface for Machinery        Monitoring System,” the entire contents of which are        incorporated herein by reference.

FIELD

This invention relates to the field of machine control and machinecondition monitoring. More particularly, this invention relates to auniversal sensor interface for accommodating multiple sensor types foruse in a machinery monitoring system.

BACKGROUND

In conventional machine protection and prediction monitoring systems,many different types of sensors are used to measure various propertiesof a machine, such as eddy current sensors, seismic sensors, passivemagnetic sensors, piezo electric sensors, Hall-effect sensors, and lowfrequency sensors. Each of these sensor types has its uniquecharacteristics related to sensor supply voltages and currents andsignal output voltage ranges. To accommodate these many different typesof sensors, a large number of different sensor input modules have to bedeveloped, tested and stocked. Separate modules are typically alsoneeded for tachometer inputs. If a single sensor interface module couldhandle all these various sensors and measurements, project managementwould be easier, production and procurement would be morecost-effective, and the number of devices in stock and the spare partsneeded could be significantly reduced.

Supplying power to a plurality of sensors from a single multichannelvibration acquisition card has historically necessitated cumbersomecircuit complexity due to practical application considerations,including:

-   -   Avoidance of potential adverse consequences arising from a        sensor or wiring fault that results in shorted sensor power,        including:        -   Damage to the immediate hardware;        -   Excessive power dissipation causing smoke or fire hazard;        -   Excessive demand placed upon the singular sensor power            supply;        -   Adverse impact upon healthy adjacent sensor functionality;        -   Generation of incorrect control or alarm values derived from            adversely affected adjacent sensor readings; and        -   Overall acquisition card failure;    -   Avoidance of potential adverse consequences arising from a        concurrent plurality of sensor wiring faults, including:        -   Adverse impact upon cards adjacent to and upstream from the            faulted card;        -   Excessive demand placed upon the common board-level and the            upstream sensor power supplies;        -   Excessive temperature elevation within the system enclosure;            and        -   Overall acquisition system failure;    -   Minimization of adverse data integrity effects in healthy sensor        channels arising from the make/break chatter of faulty or loose        adjacent sensor wiring connections;    -   Minimization of adverse data integrity effects in healthy sensor        channels arising from the practice of “hot wiring” adjacent        sensor connections;    -   Avoidance of adverse consequences resulting from sensor-terminal        miss-wiring, e.g., connecting a +24V output to a −24V output;    -   Avoidance of adverse consequences resulting from connecting an        external DC voltage source to a sensor supply output; and    -   Minimization of instantaneous energy available for the        generation of hazardous sparks (pertinent to safety-critical        environments, e.g. Class 1 Division 2).

The above considerations can present significant challenges to realizingcost-effective and space-constrained implementations of sensor powersupply circuitry. There exists a dearth of effective integratedsolutions from electronic component manufacturers, possibly due to theuncommon nature of sensor power, i.e., relatively high DC voltage atrelatively low current. It is more typical to find integrated solutionsfor the mirror condition of low voltage and high current.

Hardware implementations of sensor interfaces in the prior art applyvarious combined techniques to accomplish the overall desiredperformance goals. These techniques tend to involve high complexity andover-specification of components and power supplies, and are often notcongruent with practical space constraints. Fundamentally, acomprehensive sensor supply implementation for a multichannel sensorinterface card should:

-   -   (1) provide a fast (virtually instantaneous) limiting response        to a short-circuit fault;    -   (2) provide an accurate limiting response to a short-circuit        fault;    -   (3) survive a continuous short-circuit fault;    -   (4) survive a plurality of concurrent continuous short-circuit        faults in congruence with uninterrupted electrical and thermal        integrity of the acquisition system;    -   (5) automatically recover from short circuit faults;    -   (6) reduce power consumption/dissipation when in a faulted        condition;    -   (7) isolate adverse effects of a faulted channel from uninvolved        channels on the same card;    -   (8) isolate adverse effects of loose wiring termination        “chatter” from uninvolved channels on the same card;    -   (9) protect against adverse effects resulting from the practice        of “hot wiring” sensors;    -   (10) protect the card and the system against reasonably        anticipated installation wiring errors; and    -   (11) minimize the availability of spark-inducing energy to the        field wiring.

Although the sensible application of discrete semiconductors can realizeattribute (1) above, the electrical DC parameters of those devicesexhibit significant variability, particularly when evaluated over theindustrial temperature range. This variability hampers the ability toachieve attribute (2) when using the same circuitry as used to achieveattribute (1). Alternatively, one can readily implement attribute (2)through the use of a common op-amp, with the resulting solutionexhibiting a response time that is too slow to achieve attribute (1). Itfollows that it may be reasonable to combine the op-amp and discretesolutions together in a parallel path, thereby achieving coarse, butnearly instantaneous limiting, that eventually settles into accuratelong-term limiting. This approach has been implemented in prior art.However, due to variability of the initial coarse limiting stage, themethod is not an optimum approach for realizing attributes (7), (8), (9)and (11) above.

What is desired is a universal sensor interface for a machine protectionand prediction monitoring system that includes a sensor power controlcircuit that adequately achieves all of attributes (1) through (11)listed above.

SUMMARY

To overcome DC parameter variability in the discrete bipolar transistorand take full advantage of its fast response to transients, the highlyvariable parameter of base-emitter turn-on voltage (V_(BEon)) must beremoved from the equation. Embodiments of the invention described hereinadequately fulfill this requirement by use of a small capacitor to holdthe instantaneous DC operating value of V_(BEon), whatever that voltagemay be. Because the voltage on a capacitor cannot changeinstantaneously, this held value can act as a current-controllingreference for the transistor over a very short period of time, e.g.,immediately following an output short-circuit event. Preferredembodiments also provide an adequately fast secondary controllingmechanism for the indefinitely longer time period immediately followingthe initial fault event.

While the use of a capacitor can overcome the issue of V_(BEon)variability during the initial stage of a fault, the response time of atypical op-amp impedes its ability to provide the follow-up controllingmechanism. A comparator would appear to be more commensurate with thatfunction, since even some ultralow-power devices (with consumptionmeasured in the tens of microamperes) have acceptable response times.However, comparators are not intended for use as continuous signalamplifiers, and many contain internal positive feedback that preventstheir application in this manner. Comparators can, however, be usefulbuilding blocks for switching topologies. The result of this line ofthought are embodiments of a switching topology that provide optimalsolutions to the problem at hand. After significant time spent inconceptualization and simulation, the inventors have derived a simpleand practical implementation that has been realized and verified inhardware.

Although one might suggest that providing protection against sensor orwiring fault scenarios is not a core function of sensor interfacehardware, this viewpoint would justifiably be rejected by equipment endusers. Sensor wiring issues are not uncommon occurrences, and if theeffects from a single-channel fault are not contained to the faultedchannel, a likely consequence will be a disgruntled equipment user.Absent the inclusion of the solutions described herein, a multi-channelsensor interface card design may need to incorporate a separate sensorpower supply for each channel, incurring extra cost and complexity, andhaving the channel density per card, cabinet or rack dictated by spacingconstraints. Preferred embodiments described herein consume minimalprinted circuit board area.

Also described herein is sensor signal conditioning circuitry thatconditions sensor signals prior to digitization. A preferred embodimentof the signal conditioning circuitry uses precision components (0.1%thin film resistors) to avoid the need for calibration of gain andoffset and to minimize front-end resistor current noise (also known as“extra” noise). Precision components (1% capacitors) also are used tomaintain good common-mode rejection throughout the pass-band.

Further, implementation of 64 x oversampling in a delta-sigma ADC pushesthe frequency dependency outside of the measurement range. Suchoversampling greatly loosens requirements of the antialiasing filterthat is part of the signal conditioning circuitry, thereby reducing thefilter's effect upon pass-band signals, and likewise reducingsensitivity to filter component tolerances.

Preferred embodiments of the signal conditioning circuitry use onlypassive filter circuits, which can be much less complex than activecircuitry due at least in part to the absence of active components. Theplacement of passive Nyquist filtering upstream of active signalconditioning circuitry helps to shield the active circuitry against RFenergy that might potentially be introduced by sensor field wiring.

Embodiments of the invention described herein provide a sensor power andsignal conditioning circuit of a machinery health monitoring module. Thesensor power and signal conditioning circuit includes a sensor interfaceconnector, signal conditioning circuitry, sensor power supply circuitry,configuration circuitry, and analog-to-digital conversion circuitry.

The sensor interface connector receives an analog sensor signalgenerated by a connected sensor. In preferred embodiments, the sensorinterface connector is operable to connect to multiple types of sensorsthat may be attached to a machine to monitor various characteristics ofthe machine.

The signal conditioning circuitry includes a plurality of sensor signalconditioning circuits, each for accommodating a sensor signal inputrange that is different from one or more sensor signal input rangesaccommodated by other of the sensor signal conditioning circuits. Thesignal conditioning circuitry also includes a first softwarecontrollable switch that, based on an input range selection signal,selects one of the plurality of sensor signal conditioning circuits toreceive the analog sensor signal generated by the connected sensor.

The sensor power supply circuitry, which supplies power to the connectedsensor, includes a plurality of individually selectable sensor powercircuits, each for providing power over a voltage range that isdifferent from one or more voltage ranges provided by other of thesensor power circuits. The sensor power supply circuitry also includes asecond software controllable switch that, based on a power rangeselection signal, selects one of the plurality of sensor power circuitsto provide power to the connected sensor. The configuration circuitgenerates the input range selection signal and the power range selectionsignal based at least in part on a user selection of the type ofconnected sensor.

In some embodiments, the sensor interface connector is operable toconnect to multiple types of sensors, including piezo accelerometers,Integrated Circuit Piezoelectric (ICP) vibration sensors, piezo dynamicpressure sensors, electro-dynamic velocity sensors, eddy currentdisplacement sensors, AC vibration sensors, DC displacement sensors,passive electro-magnetic sensors, Hall Effect tachometer sensors, shaftencoder sensors, and TTL pulse sensors.

In some embodiments, the sensor signal conditioning circuits supportinput signals over a +12 volt to −12 volt range, a +24 volt to −24 voltrange, a 0 volt to +24 volt range, and a 0 volt to −24 volt range. Insome embodiments, the individually selectable sensor power circuitsinclude a zero milliamp to 20 milliamp constant current source.

In another aspect, embodiments of the invention provide a sensor powercontrolling circuit of a machinery health monitoring module. The sensorpower controlling circuit includes (1) a positive voltage input forreceiving a positive voltage from a galvanically isolated voltage sourcewithin the machinery health monitoring module, (2) a sensor powerconnector for providing power to a sensor, (3) a push-pull comparatorhaving a positive input, a negative input, and an output, (4) a firstresistor, (5) a PNP transistor, and (6) a first capacitor.

The PNP transistor has a base, an emitter and a collector. The base iselectrically coupled to a second side of the first resistor. The emitteris electrically coupled to the negative input of the push-pullcomparator through a first resistor divider network, to the positivevoltage input of the sensor power circuit through a second resistor, andto the positive input of the push-pull comparator through a secondresistor divider network. The collector is electrically coupled to thesensor power connector.

The first resistor has a first side that is electrically coupled to theoutput of the push-pull comparator. The first capacitor has a first sidethat is electrically coupled to the second side of the first resistorand to the base of the PNP transistor. The first capacitor has a secondside that is electrically coupled to the positive voltage input of thesensor power circuit and to the positive input of the push-pullcomparator via the second resistor divider network.

When a base current at the base of the PNP transistor is at a levelsufficient to cause the PNP transistor to be in a saturated ON state,the PNP transistor electrically couples the positive voltage input ofthe sensor power circuit to the sensor power connector.

During normal operation, current flowing through the second resistorinto the emitter of the PNP transistor is below a nominal thresholdcurrent level, which causes a first bias voltage on the positive inputof the push-pull comparator to be less than a second bias voltage on thenegative input of the push-pull comparator, thereby causing a low-statevoltage to appear at the output of the push-pull comparator.

A first RC time constant exists as determined by the capacitance of thefirst capacitor and a total effective resistance at the base node of thePNP transistor. When the transistor collector current increases abruptlyrelative to the first RC time constant, such as would occur immediatelyfollowing a short circuit across the sensor power connector, voltageacross the second resistor increases faster than voltage across thefirst capacitor increases, resulting in an instantaneous net reductionof emitter-base voltage of the PNP transistor. The net reduction of theemitter-base voltage of the PNP transistor impedes the PNP transistorfrom delivering increased load current for a time period that is greaterthan the propagation delay from the inputs to the output of thepush-pull comparator.

When load current demand exceeds the nominal threshold current level,such as would occur when a short circuit exists across the sensor powerconnector, three events occur:

-   -   (1) The current flowing through the second resistor into the        emitter of the PNP transistor rises to above the nominal        threshold current level, which causes the first bias voltage on        the positive input of the push-pull comparator to be greater        than the second bias voltage on the negative input of the        push-pull comparator, thereby causing a high-state voltage to        appear at the output of the push-pull comparator.    -   (2) The high-state voltage at the output of the push-pull        comparator sources current into the first capacitor, which        reduces the base current available to the PNP transistor.    -   (3) The reduced base current of the PNP transistor causes        reduction of current into the emitter of the PNP transistor,        which causes the current flowing through the second resistor to        decrease to below the nominal threshold current level. This        causes the first bias voltage on the positive input of the        push-pull comparator to be less than the second bias voltage on        the negative input of the push-pull comparator, which in turn        causes the low-state voltage to reappear at the output of the        push-pull comparator.        Events (1), (2) and (3) repeat at a first rate while the load        current demand exceeds the nominal threshold current level. In        some embodiments, the first rate is about 1.0 MHz.

In some embodiments, the sensor power circuit includes a non-linearfoldback circuit comprising a Zener diode and a third resistor. TheZener diode has a cathode that is electrically coupled to the negativeinput of the push-pull comparator. The third resistor is electricallycoupled between the anode of the Zener diode and the collector of thePNP transistor. When a voltage on the collector of the PNP transistorfalls below a threshold voltage, the Zener diode begins to conduct,thereby drawing current through the third resistor from the negativeinput node of the push-pull comparator. The current drawn from thenegative input node of the push-pull comparator modifies the second biasvoltage of the push-pull comparator. This results in a reduced currentlevel flowing through the PNP transistor and thus reduced powerdissipation in the PNP transistor when the sensor power connector isshorted or is pulled negative by an external voltage source.

In some embodiments, the output voltage (V_(OUT)) and the output current(I_(OUT)) at the sensor power connector are characterized by thefollowing nominal foldback limiting function:

-   -   V_(OUT)≧6V, I_(OUT)=39.2 mA Max    -   V_(OUT)=5V, I_(OUT)=35.9 mA Max    -   V_(OUT)=4V, I_(OUT)=31.7 mA Max    -   V_(OUT)=3V, I_(OUT)=27.3 mA Max    -   V_(OUT)=2V, I_(OUT)=23.0 mA Max    -   V_(OUT)=1V, I_(OUT)=18.6 mA Max    -   V_(OUT)=0V, I_(OUT)=14.2 mA Max.

In some embodiments, the sensor power circuit includes a fourthresistor, a second capacitor, a third capacitor and a fourth capacitor.The fourth resistor is coupled between the base and the emitter of thePNP transistor and assists with cutoff of the PNP transistor. The secondcapacitor is electrically coupled between the second side of the firstcapacitor and the positive input of the push-pull comparator. The thirdcapacitor is electrically coupled between the emitter of the PNPtransistor and the negative input of the push-pull comparator. Thefourth capacitor is electrically coupled between the positive input ofthe push-pull comparator and the output of the push-pull comparator. Thesecond, third and fourth capacitors promote deterministic astablebehavior of the sensor power circuit.

In some embodiments, the sensor power circuit includes a fifth capacitorthat is electrically coupled between the collector of the PNP transistorand electrical ground. The fifth capacitor promotes closed-loopstability when current limiting is in effect.

In yet another aspect, preferred embodiments of the invention provide asensor signal conditioning circuit of a machinery health monitoringmodule. The sensor signal conditioning circuit, which is disposedbetween a machine sensor and an analog-to-digital converter (ADC),includes a sensor interface connector, a first and second operationalamplifier, a passive Nyquist filter, and first and second gainflattening feedback networks.

The sensor interface connector is operable to connect to multiple typesof sensors that may be attached to a machine to monitor variouscharacteristics of the machine. The sensor interface connector includesa negative sensor signal input and a positive sensor signal input forreceiving a differential analog sensor signal generated by a connectedsensor.

The first operational amplifier, which provides a high impedancedifferential interface to the analog sensor signal and a low impedanceinterface to the positive ADC input, has a negative signal input, apositive signal input, and a signal output. The second operationalamplifier provides an inverted copy of the signal output from the firstoperational amplifier and a low impedance interface to the negative ADCinput, the operational amplifier having a negative signal input, apositive signal input, and a signal output.

The passive Nyquist filter is connected between the negative sensorsignal input of the sensor interface connector and the negative signalinput of the first operational amplifier. The passive Nyquist filter isalso connected between the positive sensor signal input of the sensorinterface connector and the positive signal input of the firstoperational amplifier.

The first gain flattening feedback network is connected between thenegative signal input of the first operational amplifier and the outputof the second operational amplifier. The second gain flattening feedbacknetwork is connected between the positive signal input of the firstoperational amplifier and the output of the first operational amplifier.

Connections to the ADC include a positive ADC input connection and anegative ADC input connection. Both of these connections areelectrically coupled to the signal outputs of the operationalamplifiers.

In some embodiments, the passive Nyquist filter includes resistors R15,R16, R18 and R19, and capacitors C8, C9 and C10. A first side of theresistor R15 is electrically coupled to the negative sensor signal inputof the sensor interface connector. A first side of the resistor R16 iselectrically coupled to the second side of the resistor R15. A secondside of the resistor R16 is electrically coupled to the negative signalinput of the first operational amplifier. A first side of the resistorR18 is electrically coupled to the positive sensor signal input of thesensor interface connector. A first side of the resistor R19 iselectrically coupled to the second side of the resistor R18. A secondside of the resistor R19 is electrically coupled to the positive signalinput of the first operational amplifier. The capacitor C8 has a firstside that is electrically coupled to the second side of the resistorR15, and a second side that is electrically coupled to electricalground. The capacitor C9 has a first side that is electrically coupledto the second side of the resistor R15, and a second side that iselectrically coupled to the second side of the resistor R18. Thecapacitor C10 has a first side that is electrically coupled to thesecond side of the resistor R18, and a second side that is electricallycoupled to electrical ground. The resistors R15, R16, R18 and R19 arepreferably thin film resistors having a resistance value tolerance of nomore than 0.1%. The capacitance values of the capacitors C8, C9 and C10preferably have a tolerance of no more than 1%.

In some embodiments, the sensor signal conditioning circuit includes aresistor R17 having a first side that is electrically coupled to thenegative signal input of the first operational amplifier, and a secondside that is electrically coupled to the positive ADC input connection.The gain of the sensor signal conditioning circuit of these embodimentsis determined by twice the ratio of the resistance value of the resistorR17 to a sum of the resistance values of the resistors R15 and R16. Theresistor R17 is preferably a thin film resistor having a resistancevalue tolerance of no more than 0.1%.

In some embodiments, the sensor signal conditioning circuit includes anadjustable DC offset input. These embodiments also include a resistorR20 having a first side that is electrically coupled to the positivesignal input of the first operational amplifier, and a second side thatis electrically coupled to the adjustable DC offset input. The inputdifferential voltage offset of the sensor signal conditioning circuit ispreferably determined by the product of a multiplicand: the ratio of thesum of the resistance values of the resistors R18 and R19 to theresistance value of the resistor R20, and a multiplier: the differencebetween the fixed +2.5V DC offset voltage and the adjustable DC offsetvoltage. The resistor R20 is preferably a thin film resistor having aresistance value tolerance of no more than 0.1%.

In some embodiments, the first gain flattening feedback network includesa capacitor C13 and a resistor R25. A first side of the capacitor C13 iselectrically coupled to the negative signal input of the firstoperational amplifier. The resistor R25 has a first side that iselectrically coupled to the second side of the capacitor C13, and asecond side that is electrically coupled to the signal output of thesecond operational amplifier.

In some embodiments, the second gain flattening feedback networkincludes a capacitor C14 and a resistor R26. A first side of thecapacitor C14 is electrically coupled to the positive signal input ofthe first operational amplifier. The resistor R26 has a first side thatis electrically coupled to the second side of the capacitor C14, and asecond side that is electrically coupled to the signal output of thefirst operational amplifier. The resistors R25 and R26 preferably have atolerance of no more than 1%. The capacitance values of the capacitorsC13 and C14 preferably have a tolerance of no more than 1%.

In some embodiments, the operational amplifier is powered by a singlerail +5 VDC power connection, with no need for a negative powerconnection.

In some embodiments, the variation in signal gain from the sensorinterface connector through to the input of the ADC over a frequencyrange of zero to 40 KHz is no more than about 0.8%, even with nocalibration.

BRIEF DESCRIPTION OF THE DRAWINGS

Other embodiments of the invention will become apparent by reference tothe detailed description in conjunction with the figures, whereinelements are not to scale so as to more clearly show the details,wherein like reference numbers indicate like elements throughout theseveral views, and wherein:

FIG. 1 depicts a machinery health monitoring (MHM) module according toan embodiment of the invention;

FIG. 2 depicts field digital FPGA signal processing circuitry accordingto an embodiment of the invention;

FIG. 3 depicts an example of control logic executed by a DCS controlleraccording to an embodiment of the invention;

FIG. 4 depicts a preferred embodiment of a universal signal conditioningand sensor power card according to an embodiment of the invention;

FIGS. 5 and 6 depict a preferred embodiment of a sensor power controlcircuit having instantaneous current limiting and incorporatingnonlinear foldback according to an embodiment of the invention;

FIG. 7 depicts a sensor signal conditioning amplifier according to anembodiment of the invention;

FIGS. 8, 9 and 10 depict normalized amplifier gain versus frequencycurves for a preferred embodiment of the sensor signal conditioningamplifier;

FIGS. 11 and 12 depict nominal foldback characteristics provided by apreferred embodiment of a sensor power circuit;

FIGS. 13 and 14 depict simulation plots showing currents and voltagesassociated with the power control circuit components of a preferredembodiment in response to an output short circuit event;

FIG. 15 depicts the results of a Monte Carlo simulation of the pass-bandgain of a preferred embodiment of a signal conditioning amplifier fromDC to 4 KHz, using a purely random distribution of component tolerances;and

FIG. 16 depicts the results of a Monte Carlo simulation of the commonmode rejection (CMR) of a preferred embodiment of a signal conditioningamplifier at 100 Hz, using a Gaussian distribution of componenttolerances.

DETAILED DESCRIPTION

Preferred embodiments of a universal sensor interface may be implementedin a vibration data acquisition and analysis module that interfacesdirectly to a distributed control system I/O backplane to allow directacquisition of vibration data by the DCS for purposes of machineryprotection and predictive machinery health analysis. As the term is usedherein, a “distributed control system (DCS)” is a type of automatedcontrol system used in a process or plant in which control elements aredistributed throughout a machine or multiple machines to provideoperational instructions to different parts of the machine(s). As theterm is used herein, “protection” refers to using data collected fromone or more sensors (vibration, temperature, pressure, etc.) to shutdown a machine in situations in which severe and costly damage may occurif the machine is allowed to continue running. “Prediction” on the otherhand refers to using data collected from one or more vibration sensors,perhaps in combination with data from other types of sensors, to observetrends in machine performance and predict how much longer a machine canoperate before it should be taken offline for maintenance orreplacement.

FIG. 1 depicts a machinery health monitoring module (MHM) 10 thatdirectly interfaces with a DCS 11. In the preferred embodiment, themodule 10 includes a field analog signal conditioning and sensor powercard 12 that receives and conditions sensor signals, a field digitalFPGA signal processing card 14 that processes the sensor signals, and aDCS logic generator card (LGC) 16 that provides an interface to a DCSI/O bus 18. The field card 12 can preferably accept input from up toeight measurement sensors 20 through a field signal interface connector22. In a preferred embodiment, two of the sensor input channels may beconfigured as tachometer channels.

Preferably, galvanic electrical isolation is provided between the analogfield card 12 and the digital field card 14. This electrical isolationprevents unintentional current flow, such as due to ground loops,between the mounting locations of the sensors 20 and the DCS 11.

As described in more detail hereinafter, sensor power circuit 24 andsignal conditioning circuit 26 can support a wide range of sensors 20,including piezo accelerometers, piezo ICP velocity, piezo dynamicpressure, electro-dynamic velocity, eddy current displacement, ACvibration, and DC displacement. Tachometer sensors that are supportedinclude eddy current displacement sensors, passive electro-magneticsensors, Hall Effect tachometer sensors, N pulse/rev shaft encoders, andTTL pulse sensors. Many additional sensor types are supported over thefrequency range of DC to 20 KHz as long as they fall within thefollowing exemplary voltage input ranges: 0 to +24V, −24V to +24V, −12Vto +12V, and 0 to −24V. In the preferred embodiment, up to eight sensorpower circuits 24 can be individually programmed for a constant currentof between 0 and 20 mA, which may also be used as lift current for anelectro-dynamic (passive) velocity sensor. Constant voltage sources (+24VDC or −24 VDC) may be selected as well as constant current. The inputvoltage ranges listed above are also individually programmable on eachsensor channel. This permits any mix of sensor power and input rangeconfiguration between the channels, thereby enabling a mix of supportedsensors.

With timing provided by a clock 26, an 8-channel analog-to-digitalconverter (ADC) 28 converts the eight analog signals into a singleserial data stream comprising eight simultaneously sampled interleavedchannels of data. In some preferred embodiments, two tachometertriggering circuits 30 convert the two analog tachometer signals intotachometer pulses.

On the field card 14 is an 8-channel field programmable gate array(FPGA) 36 for processing the vibration data. The FPGA 36 receives the8-channel digital waveform data and 2-channel tachometer data andprocesses the raw data in parallel to generate scalar overall vibrationparameters and waveforms. The processed waveforms may include low-passfiltered, PeakVue™, order tracking, high-pass filtered (DC blocked), andselectable single-integrated (velocity), double-integrated(displacement), or non-integrated (acceleration) waveforms. Predictiondata channels also preferably include an up-sampling data block toprovide higher resolution data for Time Synchronous Averaging (TSA) ororder tracking applications.

The vibration card configuration circuit 32 of the analog field card 12preferably includes of a set of serial-to-parallel latch registers thataccept a serial data stream of configuration data from the applicationfirmware of the LGC 16. This data is loaded into a parallel-to-serialshift register in the interface of the FPGA 36. The FPGA 36 then handlesshifting the serial data to the control latches using a synchronous SPIformat.

During operation of the preferred embodiment, the MHM module 10 appearsto the DCS controller 19 as a multichannel analog input card havingscalar outputs similar to those of a standard DCS input module 21, suchas may be outputting measured temperature, pressure, or valve positionvalues. As discussed in more detail hereinafter, vibration signals areconverted to scalar values by the module 10 and presented to the DCScontroller 19 via the backplane of the DCS. One example of a DCScontroller 19 is the Ovation™ controller manufactured by Emerson ProcessManagement (a division of Emerson Electric Co.). In the typical DCSarchitecture, only sixteen scalar values are presented as high speedscan values to the DCS controller 19. In a high speed scan, the DCScontroller 19 can read these sixteen scalar values at up to a 10 mSrate.

Time waveform block data (and some scalar values) may be transferred tothe DCS controller 19 via the DCS I/O bus 18 using a block data transfermethod, such as Remote Desktop Protocol (RDP), at a rate that is lowerthan the scan rate of the sixteen scalar values.

As the scalar values generated by the machinery health monitoring module10 are read by the DCS controller 19, they are processed by softwarerunning in the DCS controller 19 in the same manner as any other DCSdata. One primary function of the DCS controller 19 is to compare thescalar values with alarm limits. If the limits are exceeded, alarms aregenerated. Logic within the DCS controller 19 may also determine whetherany actions should be taken based on alarm conditions, such as closing arelay. Operations including alarm relay logic, voting, and time delaysare also performed in software by the DCS controller 19. Preferably, DCScontrol outputs, such as relay outputs and 4-20 mA proportional outputs,are driven by standard output modules 23 of the DCS. Bulk predictiondata is formatted in the LGC host processor 48 and is transmitted via anEthernet port 52 a to a machine health management (MHM) analysiscomputer 54 for detailed analysis and display. Bulk protection data isalso formatted in the LGC host processor 48, but is transmitted via aseparate Ethernet port 52 b to the DCS operator computer 60.

In preferred embodiments, a DCS operator computer 60 includes aninterface for displaying vibration parameters and other machineoperational data (pressures, temperatures, speeds, alarm conditions,etc.) that are output from the DCS controller 19.

A functional block diagram of a single channel of the field digital FPGA36 is depicted in FIG. 2. A preferred embodiment includes sevenadditional channels having the same layout as the one channel depictedin FIG. 2. As described in more detail hereinafter, the channel digitalwaveform data may be routed through a variety of digital filters andintegration stages before being converted to vibration overall values orpackaged as “bulk” time waveforms for further analysis by softwarerunning on the LGC card 16 or for transmission to DCS software or MHMsoftware.

As shown in FIG. 2, an ADC interface 70 receives the eight channels ofcontinuous, simultaneously sampled data from the ADC 28 of the fieldanalog card 12 through the connector 34 (shown in FIG. 1). The data ispreferably in the form of a multiplexed synchronous serial data streamin Serial Peripheral Interface (SPI) format. The ADC interface 70de-multiplexes the data stream into eight separate channel data streams.

Although all eight channels could be used for vibration signalprocessing, in a preferred embodiment two of the eight channels may beused for tachometer measurement processing. Each tachometer measurementchannel preferably includes:

-   -   a one-shot 110, which is a programmable trigger “blanking”        function that provides noise rejection for tachometer pulse        trains having excessive jitter or noise;    -   a divide-by-N 111, which is a programmable pulse divider that        divides pulse rates of tachometer signals produced by gears or        code wheels;    -   a reverse rotation detector 112 that determines the direction of        shaft rotation by comparing the phase of two tachometer pulse        signals;    -   an RPM indicator 115 that calculates the RPM of the tachometer        pulse stream as a scalar overall value.    -   a zero-speed detector 113 that provides a “zero speed”        indication when the tachometer has been inactive for a        programmable interval, such as 0.1 s, 1 s, 10 s, or 100 s; and    -   an over-speed detector 114 that provides an “over speed”        indication when the tachometer exceeds a fixed 2 KHz or 62 KHz        threshold. In alternative embodiments, this threshold may be        programmable.

With continued reference to FIG. 2, each of the eight independentparallel channels of signal processing in the FPGA 36 preferablyincludes the following components:

-   -   a high pass filter 72 for DC blocking, which is preferably be        set to 0.01 Hz, 0.1 Hz, 1 Hz, or 10 Hz, and which may be        selected or bypassed for the integrators described below based        on the position of a switch 74;    -   two stages of digital waveform integration, including a first        integrator 76 and a second integrator 78, which provide for data        unit conversion from acceleration to velocity, acceleration to        displacement, or velocity to displacement;    -   a digital tracking band pass filter 82 having a band pass center        frequency that is set by the tachometer frequency or multiples        of the tachometer frequency, and that receives as input either        the “normal” data stream (no integration), the single        integration data stream, or the double integration data stream        based on the position of a switch 80, as described in more        detail below; and    -   scalar overall measurement calculation blocks 88-100 that        determine several different waveform scalar overall values as        described below.

In the preferred embodiment, the purpose of the digital tracking bandpass filter 82 is to provide a narrow (high Q) band pass response with acenter frequency determined by the RPM of a selected tachometer input.The center frequency may also be a selected integer multiple of thetachometer RPM. When a waveform passes through this filter, onlyvibration components corresponding to multiples of the turning speed ofthe monitored machine will remain. When the RMS, peak, or peak-to-peakscalar value of the resultant waveform is calculated by thecorresponding FPGA calculation block (88, 90 or 92), the result is sameas a value that would be returned by an “nX peak” calculation performedin the application firmware of the LGC 16. Because this scalarcalculation is performed as a continuous process in the FPGA 36 ratherthan as a calculation done in firmware, it is better suited to be a“shutdown parameter” as compared to a corresponding value produced at alower rate in firmware. One application of this measurement is inmonitoring aero-derivative turbines, which generally require a trackingfilter function for monitoring.

For several of the scalar overall values, the individual data type fromwhich the values are calculated may be selected from the normal datastream, the single-integrated data stream, the double-integrated datastream, the high-pass filtered (DC blocked) data stream, or the trackingfilter data stream based on the positions of the switches 84 a-84 d.Also, several of the scalar overall channels have anindividually-programmable low-pass filter 88 a-88 d. In the preferredembodiment, these scalar overall values are generated independently ofand in parallel to the time waveforms that are used for prediction orprotection. The scalar overall measurement calculation blocks preferablyinclude:

-   -   an RMS block 88 that determine the RMS value of the time        waveform, where the RMS integration time may preferably be set        to 0.01 s, 0.1 s, 1 s, or 10 s;    -   a peak block 90 that determines the greater of the positive or        negative waveform peak value relative to the average value of        the waveform, which is preferably measured over a period        determined by either the tachometer period or a programmable        time delay;    -   a peak-peak block 92 that determines the waveform peak-to-peak        value over a period determined by either the tachometer period        or a programmable time delay;    -   an absolute +/− peak block 94 that determines the value of the        most positive signal waveform excursion and the value of the        most negative signal waveform excursion relative to the zero        point of the measurement range, which is preferably measured        over a period determined by either the tachometer period or a        programmable time delay;    -   a DC block 96 that determines the DC value of the time waveform,        which has a measurement range preferably set to 0.01 Hz, 0.1 Hz,        1 Hz, or 10 Hz; and    -   a PeakVue™ block 100 that determines a scalar value representing        the peak value of the filtered and full-wave-rectified PeakVue™        waveform as described in U.S. Pat. No. 5,895,857 to Robinson et        al. (incorporated herein by reference), which is preferably        measured over a period determined by either the tachometer        period or a programmable time delay. Full wave rectification and        peak hold functions are implemented in the functional block 98.        The PeakVue™ waveform from the block 98 is also made available        as a selectable input to the prediction time waveform and        protection time waveform processing described herein.

The prediction time waveform processing section 116 of the FPGA 36provides a continuous, filtered time waveform for use by any predictionmonitoring functions. An independent lowpass filter/decimator 104 a isprovided so that the prediction time waveform may be a differentbandwidth than the protection time waveform. A waveform up-samplingblock 106 provides data rate multiplication for analysis types such asTime Synchronous Averaging (TSA) and Order Tracking. Input to theprediction time waveform processing section 116 may be selected from thenormal data stream, the single-integrated data stream, thedouble-integrated data stream, the high-pass filtered (DC blocked) datastream, or the PeakVue™ data stream based on the positions of the switch102 a.

The protection time waveform section 118 of the FPGA 36 provides acontinuous, filtered time waveform for use by protection monitoringfunctions. An independent low pass filter/decimator 104 b is provided sothat the protection time waveform may be a different bandwidth than theprediction time waveform. Input to the protection time waveformprocessing section 118 may be selected from the normal data stream, thesingle-integrated data stream, the double-integrated data stream, thehigh-pass filtered (DC blocked) data stream, or the PeakVue™ data streambased on the positions of the switch 102 b.

Preferred embodiments provide for transient data collection, whereincontinuous, parallel time waveforms from each signal processing channelmay be collected for transmission to external data storage. Transientwaveforms are preferably fixed in bandwidth and are collected from theprotection time waveform data stream.

As shown in FIG. 1, the scalar overall values, as well as the digitallyfiltered time waveforms, pass through the LGC interface 38 to the LGClogic board 16 for further processing and transportation to the DCScontroller 19 via the DCS I/O backplane 18 or to external softwareapplications running on the MHM data analysis computer 54 via theEthernet port 52.

FIG. 3 depicts an example of a control logic routine (also referred toherein as a control sheet) that is performed by the DCS controller 19.In preferred embodiments, a control sheet is scheduled to execute at apredetermined rate, such as 1 sec, 0.1 sec, or 0.01 sec, by the DCSsoftware running in the controller 19. As the control sheet thatcontrols the vibration process is executed, scalar overall vibrationvalues are scanned from the DCS I/O bus 18 and output values aregenerated at the execution rate of the control sheet.

Logic functions performed by the control sheets preferably include:

-   -   Voting logic, such as logic to determine that an alert condition        exists if 2 out of 2 scalar values are over threshold, or 2 out        of 3 are over threshold.    -   Combining vibration data with other DCS process parameter data        (such as pressure and temperature).    -   Trip multiply, which is a temporary condition determined by        current machine state or by manual input that increases an alarm        level. Trip multiply is typically used during the startup of a        rotational machine, such as a turbine. As the turbine speeds up,        it normally passes through at least one mechanical resonance        frequency. Since higher than normal vibration conditions are        measured during this resonance, “trip multiply” is used to        temporarily raise some or all of the alarm levels to avoid a        false alarm trip. The trip multiply input may be set manually        with operator input, or automatically based on RPM or some other        “machine state” input.    -   Trip bypass, which is typically a manual input to suppress        operation of the output logic to disable trip functions, such as        during machine startup. Trip bypass is a function that        suppresses either all generated vibration alarms, or any outputs        that would be used as a trip control, or both. The trip bypass        input may be set manually with operator input, or automatically        based on some “machine state” input.        Time delay, which is a delay that is normally programmed to        ensure that trip conditions have persisted for a specified time        before allowing a machine trip to occur. Trip time delays are        normally set to between 1 and 3 seconds as recommended by        API670. The purpose of this delay is to reject false alarms        caused by mechanical or electrical spikes or glitches.

Universal Sensor Interface

FIG. 4 depicts a preferred embodiment of a single channel of the fieldanalog signal conditioning and sensor power card 12. In this embodiment,the sensor power circuit 24 includes a software controllable switch 28that is operable to switch between a +24V power supply 24 a, a −24Vpower supply 24 b, or a programmable constant current source 24 c. Thesignal for activating the switch 28 is preferably provided by the cardconfiguration circuit 32. As shown in FIG. 4, the signal conditioningcircuit 25 includes a software controllable switch 27 that is operableto switch between multiple sensor signal conditioning circuits havingmultiple input signal ranges, including a 0 to +24V circuit 25 a, a −24Vto +24V and −12V to +12V circuit 25 b, and a 0 to −24V circuit 25 c. Thesignal for activating the switch 27 is preferably provided by the cardconfiguration circuit 32.

In a preferred embodiment, software running on the MHM data analysiscomputer 54 (FIG. 1) receives input from a user to indicate the type ofsensor 20 connected to each measurement channel. This input may be madeby selection of the sensor type from a list of sensors in a dropdownmenu displayed on a screen of the computer 54. Based on the sensor typeselection, the LGC 16 generates the data stream to set the latches ofthe card configuration circuit 32 to effect the appropriate settings ofthe switches 27 and 28.

As discussed above, to minimize the complexity of the diagram, only onesensor channel is shown in FIG. 4. In a preferred embodiment, there areeight sensor input channels that each include a software controllablesensor power circuit 24 and signal conditioning circuit 25 that areoperated independently of the circuits 24 and 25 in the other channels.Thus, the channel input configurations are independent from channel tochannel so that a variety of different sensor types may be supportedsimultaneously.

As the phrase is used herein, when two electrical components in acircuit are “electrically coupled,” it means that a terminal or pin ofone component is in electrical communication with a terminal or pin ofthe other component, either directly or through one or more interveningcomponents. Thus, for example, when a pin or terminal of a firstcomponent is electrically connected directly to a pin or terminal of asecond component, the first and second components are “electricallycoupled.” As another example, when a pin or terminal of the firstcomponent is electrically connected to a pin or terminal of anintervening component, and a pin or terminal of the interveningcomponent is electrically connected to a pin or terminal of the secondcomponent, the first and second components are “electrically coupled.”

A detailed circuit diagram of a preferred embodiment of the +24V sensorpower control circuit 24 a for one sensor channel is provided in FIG. 5.Positive 24 VDC nominal power comes in from the left side (+24V_IN) andis low-pass filtered by resistor R1 and capacitor C1. This filterattenuates residual switching noise from the input source and provides3.3Ω of series resistance to impede sensor-induced transient currentstraveling back into the circuit. Also coming in on the left side is thePOWER_ENABLE digital control signal. A nominal threshold voltage ofgreater than +1.7V on POWER_ENABLE begins turning on the NPN transistorQ2 (power enable switch) via the resistor divider composed of resistorsR13 a and R14 a. With +3.3V applied to POWER_ENABLE, the collectorvoltage of transistor Q2 approaches ground potential, pulling the bottomleg of resistor R12 a down to about 0.05V. The resultant current throughresistor R12 a charges the bypass capacitor C6, pulling the LOW_RAIL netvoltage level down to where it is clamped against the 20V LOW_RAIL_BIASvoltage by the Schottky diode D2B. This establishes 4.3V rails acrossthe supply pins of the low-power push-pull comparator U1, the output ofwhich turns on the PNP transistor Q1. While in the on state, thetransistor Q1 connects +24V through the Schottky diode D3 to theexternal load.

When powered, the comparator U1 continuously monitors the emittercurrent of the transistor Q1 via the voltage developed across theresistor R7 to detect a high load current demand indicative of a shortcircuit at the sensor power connector 22. (The resistor R7 is alsoreferred to herein as the “second resistor.”) Because the voltage acrossthe capacitor C5 cannot change instantaneously, the response of thecircuit to a shorted output is immediate. (The capacitor C5 is alsoreferred to herein as the “first capacitor.”) A sudden increase in theload current demand, which is reflected in the collector current oftransistor Q1, causes a proportionate sudden increase in the voltageacross resistor R7 (developed by the emitter current of transistor Q1).This drives the emitter voltage of transistor Q1 lower relative to itsbase voltage which is AC “locked” by the capacitor C5, therebyprohibiting a further rise in collector current of transistor Q1 andallowing time for the comparator U1 to respond to the short circuitcondition.

During normal operation, the voltage divider composed of resistors R4,R2 and R5 provides bias to the positive input of the comparator U1 thatis some tens of millivolts lower than the R3 and R6 resistor dividerprovides to the negative input, thereby sending the push-pull outputvoltage of the comparator U1 to its negative limit. If the load currentexceeds the nominal overload threshold of −39 mA, the output of thecomparator U1 changes state rapidly, swinging to its positive limit,which is bolstered by the feedback from the NPO capacitor C4 (whichintegrates onto an NPO capacitor C3, increasing the effectivetime-constant). (The capacitors C3 and C4 are also referred to herein asthe “third capacitor” and the “fourth capacitor”, respectively.) Theoutput drive from the comparator U1 injects charge into the capacitor C5through the resistor R8. (The resistor R8 is also referred to herein asthe “first resistor.”) This starves transistor Q1 of base current,thereby causing the collector current to decay to about 36 mA before thecomparator U1 again changes state after about 0.5 uS. The collectorcurrent of transistor Q1 then climbs back to 39 mA and the cycle repeatsat a rate of about 1.0 MHz for as long as the load demand exceeds theoverload threshold current. Output capacitor C7 reduces the outputswitching noise to a level of only a few millivolts during limiting.(The capacitor C7 is also referred to herein as the “second capacitor.”)

Nonlinear foldback limiting is provided by feedback through resistor R10and Zener diode Z1, for the reduction of Q1 dissipation during theoutput short-circuit fault condition. (The resistor R10 is also referredto herein as the “third.”) The NPO capacitor C2 reduces the switchingthreshold jitter caused by avalanche noise from the diode Z1. When theoutput (Q1 collector voltage) is pulled lower than about 6V, the diodeZ1 begins to conduct, thereby drawing current from the inverting node ofthe comparator U1. This modifies the comparator input bias level, andlikewise the switching threshold of the circuit, thereby resulting in alowered current limit that prevents excess Q1 dissipation when theSENSOR_PWR output is shorted or pulled negative by an external source.The nominal foldback characteristic is depicted in FIG. 11, wherein thefollowing values indicate the relationship between output voltage andlimiting current:

-   -   SENSOR_PWR=23.5V IOUT=38.7 mA    -   SENSOR_PWR=6V IOUT=39.2 mA    -   SENSOR_PWR=5V IOUT=35.9 mA    -   SENSOR_PWR=4V IOUT=31.7 mA    -   SENSOR_PWR=3V IOUT=27.3 mA    -   SENSOR_PWR=2V IOUT=23.0 mA    -   SENSOR_PWR=1V IOUT=18.6 mA    -   SENSOR_PWR=0V IOUT=14.2 mA.

The output capacitor C7 provides loop stability during foldbacklimiting. The 40V Schottky diode D3 defends the circuitry againstpositive injected voltage of greater magnitude than the internal +24Vsupply. The protection diode TVS1 has a bipolar surge clamping voltagejust under 50V. In conjunction with diode D3, the diode TVS1 protectsagainst base-emitter breakdown of the transistor Q1. The −100Vcollector-emitter rating of transistor Q1 defends against negativevoltage injection. The resistor R9 assists in the turnoff of transistorQ1 during limiting and when the POWER_ENABLE input is in the low (off)state.

FIG. 13 depicts a simulation plot showing voltages associated with thepower control circuit components in response to an output short circuitevent. The voltage curves have been offset-normalized and scaled (thecomparator output) for the purpose of display. The collector of thetransistor Q1 is sourcing 20 mA of current prior to the short circuitevent, which initiates at the 100 μsec mark. After the short circuitevent, the collector current rises sharply, peaking at about 300 mAwithin 4 nanoseconds. The peak magnitude of the current is limited bythe finite available base drive and the finite beta of the transistorQ1. Due to the short duration of this transient, negligible power isinvolved. The voltage across the resistor R7 (first resistor) increasesin conjunction with the collector current, whereas the voltage acrossthe capacitor C5 (first capacitor) increases at a much lower rate,resulting in an abrupt and significant reduction of the emitter-basevoltage. With the base drive thusly removed, the collector current dropsoff rapidly, crossing below 50 mA approximately 25 nanoseconds into theevent. At approximately 50 nanoseconds, the comparator U1 responds(bottom trace), removing base drive for the longer term.

FIG. 14 depicts the same events on an expanded the time scale to showthe long term steady-state short circuit response. As shown in FIG. 14,the Q1 collector current is firstly reduced (via the nonlinear foldback)and secondly controlled by the output voltage of the comparator U1,oscillating at a rate of approximately 1 MHz.

A detailed circuit diagram of a preferred embodiment of the −24V sensorpower control circuit 24 b for one sensor channel is provided in FIG. 6.Negative 24 VDC nominal power comes in from the left side (−24V_IN) andis low-pass filtered by the combination of resistor R1 and capacitor C1.This filter attenuates residual switching noise from the input sourceand provides 3.3Ω of series resistance to impede sensor-inducedtransient currents traveling back into the circuit. Also coming in onthe left side is the POWER_ENABLE digital control signal. A nominalthreshold voltage greater than +1.85V begins turning on the PNPtransistor Q2 (power enable switch) via the resistor divider formed byresistors R13 b and R14 b. With +3.3V applied to POWER_ENABLE, the Q2collector voltage closely follows the emitter, so that a +3.3V inputcontrol level on Q2 pulls the bottom leg of resistor R12 b up to about3.2V. The resultant R12 current charges the bypass capacitor C6, pullingthe HIGH_RAIL voltage up until clamped against the −20V HIGH_RAIL_BIASvoltage by a Schottky diode D2B. This establishes 4.3V rails across thesupply pins of the low-power comparator U1 the output of which turns onthe NPN transistor Q1. While in the on state, transistor Q1 connects−24V through the Schottky diode D3 to the external load.

When powered, the comparator U1 continuously monitors the emittercurrent of transistor Q1 via the voltage developed across resistor R7.During normal operation, the voltage divider composed of resistors R4,R2 and R5 provides bias to the positive input of comparator U1 that issome tens of millivolts higher than the R3 and R6 divider provides tothe negative input, thereby sending the push-pull output voltage ofcomparator U1 to its positive limit. If the load current exceeds thenominal overload threshold of −39 mA the output of comparator U1 changesstate rapidly, swinging to its negative limit, being bolstered by thefeedback from the NPO capacitor C4 (which integrates onto an NPOcapacitor C3, increasing the effective time-constant). The output sinkfrom comparator U1 pulls charge from capacitor C5 through resistor R8.This starves transistor Q1 of base current, causing the collectorcurrent to decay to about 36 mA before comparator U1 again changes stateafter about 0.5 uS. The collector current then climbs back to 39 mA andthe cycle repeats at a rate of about 1.0 MHz as long as the load demandexceeds the overload threshold current.

Output capacitor C7 reduces the output switching noise to the level ofonly a few millivolts during limiting. Because the voltage acrosscapacitor C5 cannot change instantaneously, the response of the circuitto a shorted output is immediate. If the voltage across resistor R7suddenly increases, the emitter of transistor Q1 is driven higherrelative to the base, which is “locked” by capacitor C5. This prohibitsa further rise in collector current and allows time for comparator U1 torespond. Nonlinear foldback limiting is provided by feedback throughresistor R10 and Zener diode Z1, for the reduction of Q1 dissipationduring the output short-circuit fault condition. The NPO capacitor C2reduces the switching threshold jitter caused by avalanche noise fromdiode Z1. When the output magnitude (absolute value of transistor Q1collector voltage) is pulled lower than about 6V, diode Z1 begins toconduct, thereby sourcing current into the inverting node of comparatorU1. This modifies the comparator input bias level, and likewise theswitching threshold of the circuit, resulting in a lowered current limitthat prevents excess Q1 dissipation when the SENSOR_PWR output isshorted or pulled positive by an external source. The nominal foldbackcharacteristic is depicted in FIG. 12, wherein the following valuesindicate the relationship between output voltage and limiting current:

-   -   SENSOR_PWR=−23.5V IOUT=−39.3 mA    -   SENSOR_PWR=−6V IOUT=−39.8 mA    -   SENSOR_PWR=−5V IOUT=−36.6 mA    -   SENSOR_PWR=−4V IOUT=−32.4 mA    -   SENSOR_PWR=−3V IOUT=−28.0 mA    -   SENSOR_PWR=−2V IOUT=−23.6 mA    -   SENSOR_PWR=−1V IOUT=−19.2 mA    -   SENSOR_PWR=0V IOUT=−15.1 mA.

Output capacitor C7 provides loop stability during foldback limiting.The 40V Schottky diode D3 defends the circuitry against negativeinjected voltage of a magnitude greater than the internal −24V supply.Protection diode TVS1 has a bipolar surge clamping voltage just under50V. In conjunction with diode D3, the diode TVS1 protects againstbase-emitter breakdown of transistor Q1. The 100V collector-emitterrating of transistor Q1 defends against positive voltage injection. Theresistor R9 assists in the turnoff of transistor Q1 during limiting andwhen the POWER_ENABLE input is in the low (off) state.

To minimize the complexity of the circuit diagrams, sensor power controlcircuits for only one sensor channel are depicted in FIGS. 5 and 6. In apreferred embodiment, there are eight sensor input channels that eachinclude sensor power control circuits 24 a and 24 b that operateindependently of the circuits 24 a and 24 b in the other channels.

Sensor Signal Conditioning Amplifier

In a preferred embodiment, the sensor signal conditioning circuit 25 isa precision differential input and output amplifier designed to providean optimal match from the various supported sensor signals to the rangeand frequency requirements of the ADC 28. Some notable features of theamplifier 25 include the following:

-   -   Precision gain provided by use of 0.1%, 25 ppm/° C. resistors;    -   Low DC offset (for accurate DC sensor measurements);    -   Low offset drift with temperature (for consistent DC sensor        measurements);    -   Low noise levels, both wideband and 1/f noise;    -   Nearly flat gain from DC to 40 KHz by use of gain equalization        network;    -   Incorporates requisite ADC Nyquist filtering;    -   Differential input rejects common mode signals;    -   High impedance inputs minimize sensor signal loading;    -   Pre-filters protect op-amp inputs from RF interference;    -   Nearly constant group delay from DC to 40 KHz;    -   Better than 1% gain accuracy with no calibration from DC to 40        KHz;    -   Single-rail 5 volt power avoids the need for negative supply;        and    -   Low material cost.

As depicted in the schematic diagram of FIG. 7, the preferred embodimentof the signal conditioning amplifier 25 is a minimalist differentialop-amp design that directly interfaces to the sensor signal inputterminals 22 to provide signal scaling and offset, and additionallydirectly drives the differential inputs of the ADC 28. It alsoincorporates the function of Nyquist filtering ahead of the ADC 28,thereby providing a nominal 110 dB rejection of out-of-band signals.Gain flattening is provided by balanced positive feedback networks 56 aand 56 b, providing a nearly flat gain response from DC to 40 KHz.

With reference to FIG. 7, the gain is established by the ratio ofprecision resistor R17 to precision resistors R15 plus R16. Thedifferential balance is provided by the ratio of precision resistor R20to precision resistors R18 and R19. The Nyquist filtering is partiallyrealized by the RC network composed of resistors R15, R16, R18, R19, andcapacitors C8, C9 and C10. Further filtering is achieved by theinteraction of resistor R17 and capacitor C11, with balance provided byresistor R20 and capacitor C12. Finally, resistors R23 and R24 andcapacitor C15 contribute filtering in the low MHz range in conjunctionwith op-amp bandwidth limitation. The balanced RC networks composed ofC13/R25 and C14/R26 provide modest gain peaking to flatten the gaincurve within the 0 to 40 KHz band of interest. Resistors R23 and R24isolate the op-amp outputs from the capacitive load of capacitor C15 toinsure op-amp stability. Capacitor C15 satisfies the interfacerequirement of the differential ADC input.

In the preferred embodiment, the DC feedback signal for the op-amp U1B(facilitated by R22) and the feedback signals driving both gainflattening networks 56 a-56 b are derived from the ADC+ and ADC− nets,i.e., from the output side of the stability-enhancing resistors R23 andR24. The DC negative feedback for the 1st op-amp (facilitated by R17) isderived from the ADC+ net. The AC feedback signals facilitated by C11and C16 are derived directly from the op-amp outputs. Assuming idealcomponents (including the op-amps), this preferred embodiment introducesno DC error into measurements, i.e., it is ideally balanced for DCsignals. FIG. 16 depicts Common Mode Rejection (CMR) histogram resultsof Monte Carlo simulations for the preferred circuit topology asdepicted in FIG. 7. Although this data was derived for a 100 Hz signal,the DC performance would be virtually identical.

The simulation curve of FIG. 8 shows the nominal normalized gain vsfrequency of a preferred embodiment of the amplifier 25 up to the ADCover-sampling Nyquist frequency of 6.5536 MHz.

The normalized curve of FIG. 9 shows the flatness of the DC to 40 KHzpass-band gain of a preferred embodiment of the amplifier 25, from thesensor signal inputs 22 to the input of the ADC 28. FIG. 15 depicts a10,000-run Monte Carlo simulation of the pass-band gain of a preferredembodiment of the amplifier 25 from DC to 40 KHz, using a purely randomdistribution of component tolerances. As FIG. 15 indicates, thepass-band gain varies by no more than about 0.8%, as calculated based on((1002.7 mV−995.6 mV)÷999.15 mV)×100%.

FIG. 10 shows the normalized gain and output phase shift of a preferredembodiment of the amplifier 25 on a linear frequency scale. The phase(dotted curve) has a near-linear relationship to frequency.Input-to-output group delay is approximately 1.5 microseconds in thepreferred embodiment.

The foregoing description of preferred embodiments for this inventionhave been presented for purposes of illustration and description. Theyare not intended to be exhaustive or to limit the invention to theprecise form disclosed. Obvious modifications or variations are possiblein light of the above teachings. The embodiments are chosen anddescribed in an effort to provide the best illustrations of theprinciples of the invention and its practical application, and tothereby enable one of ordinary skill in the art to utilize the inventionin various embodiments and with various modifications as are suited tothe particular use contemplated. All such modifications and variationsare within the scope of the invention as determined by the appendedclaims when interpreted in accordance with the breadth to which they arefairly, legally, and equitably entitled.

What is claimed is:
 1. A sensor power and signal conditioning circuit ofa machinery health monitoring module, the sensor power and signalconditioning circuit comprising: a sensor interface connector that isoperable to connect to multiple types of sensors that may be attached toa machine to monitor various characteristics of the machine, the sensorinterface connector for receiving an analog sensor signal generated by aconnected sensor; signal conditioning circuitry for conditioning theanalog sensor signal, the signal conditioning circuitry comprising: aplurality of sensor signal conditioning circuits, each sensor signalconditioning circuit for accommodating a sensor signal input range thatis different from one or more sensor signal input ranges accommodated byother of the sensor signal conditioning circuits; and a first softwarecontrollable switch for selecting one of the plurality of sensor signalconditioning circuits to receive the analog sensor signal generated bythe connected sensor, the first software controllable switch controlledby an input range selection signal; sensor power supply circuitry forsupplying power to the connected sensor, the sensor power controlcircuitry comprising: a plurality of individually selectable sensorpower circuits, each sensor power circuit for providing power over avoltage range that is different from one or more voltage ranges providedby other of the sensor power circuits; and a second softwarecontrollable switch for selecting one of the plurality of sensor powercircuits to provide power to the connected sensor, the second softwarecontrollable switch controlled by a power range selection signal; aconfiguration circuit for generating one or more of the input rangeselection signal and the power range selection signal based at least inpart on a user selection of a sensor type of the connected sensor; andanalog-to-digital conversion circuitry for converting the analogvibration signal into a digital vibration signal.
 2. The sensor powerand signal conditioning circuit of claim 1 wherein the sensor interfaceconnector is operable to connect to multiple types of sensors selectedfrom the group consisting of piezo accelerometers, Integrated CircuitPiezoelectric (ICP) vibration sensors, piezo dynamic pressure sensors,electro-dynamic velocity sensors, eddy current displacement sensors, ACvibration sensors, DC displacement sensors, passive electro-magneticsensors, Hall Effect tachometer sensors, shaft encoder sensors, and TTLpulse sensors.
 3. The sensor power and signal conditioning circuit ofclaim 1 wherein the plurality of individually selectable sensor powercircuits provide sensor power over a +12 volt to −12 volt range, a +24volt to −24 volt range, a 0 volt to +24 volt range, and a 0 volt to −24volt range.
 4. The sensor power and signal conditioning circuit of claim1 wherein the plurality of individually selectable sensor power circuitsinclude a zero milliamp to 20 milliamp constant current source.
 5. Asensor power controlling circuit of a machinery health monitoringmodule, the sensor power controlling circuit comprising: a positivevoltage input for receiving a positive voltage from a galvanicallyisolated voltage source within the machinery health monitoring module; asensor power connector for providing power to a sensor; a push-pullcomparator having a positive input, a negative input, and an output; afirst resistor having: a first side that is electrically coupled to theoutput of the push-pull comparator; and a second side; a PNP transistorhaving: a base that is electrically coupled to the second side of thefirst resistor; an emitter that is electrically coupled to the negativeinput of the push-pull comparator through a first resistor dividernetwork, the positive voltage input of the sensor power circuit througha second resistor, and the positive input of the push-pull comparatorthrough a second resistor divider network; a collector that iselectrically coupled to the sensor power connector; a first capacitorhaving: a first side that is electrically coupled to the second side ofthe first resistor and to the base of the PNP transistor; and a secondside that is electrically coupled to the positive voltage input of thesensor power circuit and to the positive input of the push-pullcomparator via the second resistor divider network; and wherein, when abase current at the base of the PNP transistor is at a level sufficientto cause the PNP transistor to be in a saturated ON state, the PNPtransistor electrically couples the positive voltage input of the sensorpower circuit to the sensor power connector, wherein, during normaloperation, current flowing through the second resistor into the emitterof the PNP transistor is below a nominal threshold current level, whichcauses a first bias voltage on the positive input of the push-pullcomparator to be less than a second bias voltage on the negative inputof the push-pull comparator, thereby causing a low-state voltage toappear at the output of the push-pull comparator, wherein a first RCtime constant exists as determined by the capacitance of the firstcapacitor and a total effective resistance at the base node of the PNPtransistor, wherein, when load current increases abruptly relative tothe first RC time constant, such as would occur immediately following ashort circuit across the sensor power connector, voltage across thesecond resistor increases faster than voltage across the first capacitordecreases, resulting in an instantaneous net reduction of emitter-basevoltage of the PNP transistor, and the net reduction of the emitter-basevoltage of the PNP transistor impedes the PNP transistor from deliveringincreased load current for a time period that is greater than thepropagation delay from the inputs to the output of the push-pullcomparator; wherein, when load current demand exceeds the nominalthreshold current level, such as would occur when a short circuit existsacross the sensor power connector, (1) the current flowing through thesecond resistor into the emitter of the PNP transistor rises to abovethe nominal threshold current level, which causes the first bias voltageon the positive input of the push-pull comparator to be greater than thesecond bias voltage on the negative input of the push-pull comparator,thereby causing a high-state voltage to appear at the output of thepush-pull comparator, (2) the high-state voltage at the output of thepush-pull comparator sources current into the first capacitor whichreduces the base current available to the PNP transistor, and (3) thereduced base current of the PNP transistor causes reduction of currentinto the emitter of the PNP transistor, thereby causing the currentflowing through the second resistor to decrease to below the nominalthreshold current level, thereby causing the first bias voltage on thepositive input of the push-pull comparator to be less than the secondbias voltage on the negative input of the push-pull comparator, therebycausing the low-state voltage to reappear at the output of the push-pullcomparator, wherein (1)-(3) repeat at a first rate while the loadcurrent demand exceeds the nominal threshold current level.
 6. Thesensor power circuit of claim 5 wherein the first rate is about 1 MHz.7. The sensor power circuit of claim 5 including a non-linear foldbackcircuit comprising: a Zener diode having: an anode; and a cathodeelectrically coupled to the negative input of the push-pull comparator;and a third resistor electrically coupled between the anode of the Zenerdiode and the collector of the PNP transistor, wherein, when a voltageon the collector of the PNP transistor falls below a threshold voltage,the Zener diode begins to conduct, thereby drawing current through thethird resistor from the negative input node of the push-pull comparator,wherein, the current drawn from the negative input node of the push-pullcomparator modifies the second bias voltage of the push-pull comparator,thereby resulting in a reduced current level flowing through the PNPtransistor and thus reduced power dissipation in the PNP transistor whenthe sensor power connector is shorted or is pulled negative by anexternal voltage source.
 8. The sensor power circuit of claim 7 whereinan output voltage (V_(OUT)) and an output current (I_(OUT)) at thesensor power connector are characterized by the following nominalfoldback limiting function: V_(OUT)≧6V, I_(OUT)=39.2 mA Max V_(OUT)=5V,I_(OUT)=35.9 mA Max V_(OUT)=4V, I_(OUT)=31.7 mA Max V_(OUT)=3V,I_(OUT)=27.3 mA Max V_(OUT)=2V, I_(OUT)=23.0 mA Max V_(OUT)=1V,I_(OUT)=18.6 mA Max V_(OUT)=0V, I_(OUT)=14.2 mA Max.
 9. The sensor powercircuit of claim 5 further comprising: a fourth resistor coupled betweenthe base and the emitter of the PNP transistor that assists with cutoffof the PNP transistor; a second capacitor electrically coupled betweenthe second side of the first capacitor and the positive input of thepush-pull comparator; and a third capacitor electrically coupled betweenthe emitter of the PNP transistor and the negative input of thepush-pull comparator; a fourth capacitor electrically coupled betweenthe positive input of the push-pull comparator and the output of thepush-pull comparator, wherein the second, third and fourth capacitorspromote deterministic astable behavior of the sensor power circuit. 10.The sensor power circuit of claim 9 further comprising a fifth capacitorelectrically coupled between the collector of the PNP transistor andelectrical ground, wherein the fifth capacitor promotes closed-loopstability when current limiting is in effect.
 11. A sensor signalconditioning circuit of a machinery health monitoring module, the sensorsignal conditioning circuit disposed between a machine sensor and ananalog-to-digital converter (ADC) having positive and negative inputs,the sensor signal conditioning circuit comprising: a sensor interfaceconnector that is operable to connect to multiple types of sensors thatmay be attached to a machine to monitor various characteristics of themachine, the sensor interface connector for receiving a differential orsingle-ended analog sensor signal generated by a connected sensor, thesensor interface connector comprising a negative sensor signal input anda positive sensor signal input; a first operational amplifier forproviding a high impedance differential interface to the analog sensorsignal and a low impedance interface to the positive input of the ADC,the first operational amplifier having a negative signal input, apositive signal input, and a signal output; a second operationalamplifier for providing an inverted copy of a signal at the positiveinput of the ADC and a low impedance interface to the negative input ofthe ADC, the second operational amplifier having a negative signalinput, a positive signal input, and a signal output; a passive Nyquistfilter connected between the negative sensor signal input of the sensorinterface connector and the negative signal input of the firstoperational amplifier, and between the positive sensor signal input ofthe sensor interface connector and the positive signal input of thefirst operational amplifier; a first gain flattening feedback networkconnected between the negative signal input of the first operationalamplifier and the negative input of the ADC; and a second gainflattening feedback network connected between the positive signal inputof the first operational amplifier and the positive input of the ADC,wherein the signal output of the first operational amplifier iselectrically coupled to the positive input of the ADC, and wherein thesignal output of the second operational amplifier is electricallycoupled to the negative input of the ADC.
 12. The sensor signalconditioning circuit of claim 11, wherein the passive Nyquist filterincludes: a resistor R15 having: a first side that is electricallycoupled to the negative sensor signal input of the sensor interfaceconnector; and a second side; a resistor R16 having: a first side thatis electrically coupled to the second side of the resistor R15; and asecond side that is electrically coupled to the negative signal input ofthe first operational amplifier; a resistor R18 having: a first sidethat is electrically coupled to the positive sensor signal input of thesensor interface connector; and a second side; a resistor R19 having: afirst side that is electrically coupled to the second side of theresistor R18; and a second side that is electrically coupled to thepositive signal input of the first operational amplifier; a capacitor C8having: a first side that is electrically coupled to the second side ofthe resistor R15; and a second side that is electrically coupled toelectrical ground; a capacitor C9 having: a first side that iselectrically coupled to the second side of the resistor R15; and asecond side that is electrically coupled to the second side of theresistor R18; and a capacitor C10 having: a first side that iselectrically coupled to the second side of the resistor R18; and asecond side that is electrically coupled to electrical ground, whereinthe resistors R15, R16, R18 and R19 comprise thin film resistors havinga resistance value tolerance of no more than 0.1%, and whereincapacitance values of the capacitors C8, C9 and C10 have a tolerance ofno more than 1%.
 13. The sensor signal conditioning circuit of claim 12further comprising a resistor R17 having: a first side that iselectrically coupled to the negative signal input of the firstoperational amplifier; and a second side that is electrically coupled tothe positive ADC input connection, wherein the gain of the sensor signalconditioning circuit is determined by twice the ratio of the resistancevalue of the resistor R17 to a sum of the resistance values of theresistors R15 and R16, and wherein the resistor R17 comprises a thinfilm resistor having a resistance value tolerance of no more than 0.1%.14. The sensor signal conditioning circuit of claim 12 furthercomprising: an adjustable DC offset input; and a resistor R20 having: afirst side that is electrically coupled to the positive signal input ofthe operational amplifier; and a second side that is electricallycoupled to the adjustable DC offset input, wherein the inputdifferential voltage offset of the sensor signal conditioning circuit isdetermined by the product of a multiplicand, which is the ratio of thesum of the resistance values of the resistors R18 and R19 to theresistance value of the resistor R20, and a multiplier, which is thedifference between a fixed DC offset voltage and a voltage at theadjustable DC offset voltage input, and wherein the resistor R20comprises a thin film resistor having a resistance value tolerance of nomore than 0.1%.
 15. The sensor signal conditioning circuit of claim 11,wherein the first gain flattening feedback network comprises: acapacitor C13 having: a first side that is electrically coupled to thenegative signal input of the first operational amplifier; and a secondside; and a resistor R25 having: a first side that is electricallycoupled to the second side of the capacitor C13; and a second side thatis electrically coupled to the signal output of the second operationalamplifier; and the second gain flattening feedback network comprises: acapacitor C14 having: a first side that is electrically coupled to thepositive signal input of the first operational amplifier; and a secondside; and a resistor R26 having: a first side that is electricallycoupled to the second side of the capacitor C14; and a second side thatis electrically coupled to the signal output of the first operationalamplifier, wherein the resistors R25 and R26 have a tolerance of no morethan 1%, and wherein capacitance values of the capacitors C13 and C14have a tolerance of no more than 1%.
 16. The sensor signal conditioningcircuit of claim 11 wherein the sensor interface connector is operableto connect to multiple types of sensors selected from the groupconsisting of piezo accelerometers, Integrated Circuit Piezoelectric(ICP) vibration sensors, piezo dynamic pressure sensors, electro-dynamicvelocity sensors, eddy current displacement sensors, AC vibrationsensors, DC displacement sensors, passive electro-magnetic sensors, HallEffect tachometer sensors, shaft encoder sensors, and TTL pulse sensors.17. The sensor signal conditioning circuit of claim 11 wherein theoperational amplifier is powered by a single rail +5 VDC powerconnection, and no negative power connection.
 18. The sensor signalconditioning circuit of claim 11 wherein variation in signal gain fromthe sensor interface connector through to the output connection to theADC over a frequency range of zero to 40 KHz is no more than about 0.8%with no calibration.